With higher Gigahertz and multiple cores packed in a SoC the need for thermal management for ARM based SoCs gets more and more critical. Thermal governors that define the policy for thermal management play a pivotal role in ensuring thermal safety of the device. Choosing the right one ensures the device performs optimally with in the thermal budget.
In this presentation Keerthy Jagadeesh, Co-maintainer TI BANDGAP AND THERMAL DRIVER explores the behavior of existing governors like step_wise, fair_share, bang_bang governors on A15 based DRA7 SoCs as an example. Governors perform differently based on the Number of Cores the SoC packs, the process node and the use cases. The results on DRA7 family of SoCs will be used to provide guide lines while choosing a particular thermal governor for a given SoC based on the above mentioned parameters.
Software Engineer (Texas Instruments)
Keerthy Jagadeesh is part of Linux core product development team of the Texas Intruments and has been an active linux contibutor for the past 8+ years. He has worked mainly on thermal management for TI SoCs, PMIC driver development, Implementing low power modes for AM437x SoCs. Currently
co maintains TI BANDGAP AND THERMAL DRIVER & maintains TI DAVINCI SERIES GPIO DRIVER.